ALPHA® RF-800 provides the broadest process window for a no-clean flux with less than 5% solids content. ALPHA RF-800 is designed to provide excellent soldering results (low defects rates), even when the surfaces to be soldered (component leads and pads) are not highly solderable. RF-800 works particularly well with bare copper boards protected with organic or rosin/resin coatings and with tin-lead coated PCB's. ALPHA RF-800 is used successfully in both tin-lead and lead-free applications.
Country of Origin
Schedule B Code
8 x 4 x 12 inches
Highly active for excellent soldering and low defect rates. Low level of non-tacky residue to reduce interference with pin testing. Cleaning is not required which reduces operating costs Reduces the surface tension between solder mask and solder to significantly reduce solder ball frequency. Meets Bellcore requirements for long-term electrical reliability.