Parker Chomerics CHO-BOND® 1030 conductive adhesive is a one component silver-plated copper filled silicone ideal for thin bond lines and bonding silicone EMI gaskets to metal substrates. CHO-BOND® 1030 is a light grey-colors silicone paste that is predominantly used for bonding elastomer gaskets.
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One component system so no mixing or measuring required Silver-plated copper filler is a low cost solution to electrical bonding Good conductivity levels (0.050 ohm-cm) Moderate adhesion properties (>200 PSI lap shear strength) Medium paste consistency means it can be used on overhead or vertical surfaces No volatile organic compounds and no corrosive by-products generated when curing